Low Theraml Conductivity Heat Sink Wcu Alloy Sheet Plate

• Customization: Available
• Application: Aviation, Electronics, Industrial, Medical, Chemical
• Standard: GB, ASTM
• Model NO.: WCu
• Purity: as Required
• Alloy: Alloy
• Shape: as Required
• Type: Tungsten Sheets
• Size: as Required
• Surface: Ground Polished
• Advantage: Professional
• Certificate: ISO9001:2000
• Delivery Time: 10-15 Days
• Transport Package: Paper Box
• Specification: as required
• Trademark: Luoyang Tongchang
• Origin: China
• HS Code: 8101999000
• Production Capacity: 4t/Month

Product Description

 Heat Sink W-Cu Alloy with Low Theraml Conductivity

W-Cu heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composition, also the composite can be machined to various shape, these features make the application of this composite with great convenience. The thermal expansion can be adjusted to match with the following material:
(1) Ceramic materials: Al₂O₃(A-90,A-95,A-99),BeO(B-95, B-99),AlN,etc;
(2) Semiconductor materials: Si, GaAs, SiGe,SiC, GaP,GaAs;
(3) Metal Material: Kovar alloy(4J29), 42 alloy;

The quality of our composite is the leader in China, contributed with our strict quality control measures. Our porosity is very low; our surface/volume ratio (measured with BET) is only 50% of similar products in the market. (Based on the measurements of 100 pieces of 5*5*2 mm W80-Cu20 composite). Our products have high hermeticity and can pass the He mass-spectrometor leak test.(<<5*10^-9Pa·m³/S).

Our Tungsten Copper Composite Features:
No Fe, Co, Ni, Mn and other elements added as the sintering activator, to maintain a high thermal conductivity
Excellent hermeticity
Can provide semi-finished or finished (Ni/Au plated) products
Precision machining and excellent dimensional control, surface finish and flatness
With close technical supports including product design, custom manufacturing, testing and post sale supports.

Product Properties:

Physical Properties of Major Products

Material	Wt% Tungsten Content	Wt% Copper Content	g/cm^3 Density at 20ºC	Thermal conductivity at 25ºC	Coefficient of thermal expansion at 20ºC
W90Cu10	90 ± 1	Balance	17.0	180 - 190	6.5
W85Cu15	85 ± 1	Balance	16.4	190 - 200	7.0
W80Cu20	80 ± 1	Balance	15.6	200 - 210	8.3
W75Cu25	75 ± 1	Balance	14.9	220 - 230	9.0
W50Cu50	50 ± 1	Balance	12.2	310 - 340	12.5