Copper/Mo70cu/Copper Composite Heat Sink CPC

• Customization: Available
• Product Type: Sheet
• Material: Cu-Mo-Cu
• Model NO.: Cu/MoCu/Cu 141
• PCD: 108mm
• ET: 35mm
• Hole: 4
• Usage: Heat Sink, BGA Package, GaAs Device Mount
• Transport Package: Paper Package
• Specification: according to your needs
• Trademark: Luoyang Tongchang
• Origin: Luoyang, Henan, China
• Production Capacity: 1000 Pieces/Month

Product Description

    Cu/MoCu/Cu is a sandwich composite similar to Cu/Mo/Cu including a MoCu alloy core layer and two copper clad layers. The normal proportion of MoCu alloy is Mo70Cu30, sometimes Mo50Cu50 and so on .The ratio of the CTE of Cu/MoCu/Cu is tailorable. It has different CTE in x and y direction, with higher thermal conductivity than that of W Cu,MoCu & CMC. All types of Cu/Mo70Cu/Cu sheets can be stamped into components.

Cu/Mo70Cu/Cu(CPC) is a sandwich composite similar to that of Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu: Mo-Cu: Cu is 1:4:1. It has different CTE in X and γ direction, with higher thermal conductivity than that of W (Mo)-Cu & Cu/Mo/Cu and less expensive. All types of Cu/Mo70Cu/Cu sheets can be stamped into components,.

Features of Cu/Mo70Cu/Cu
Large sized sheets available (length up to XXmm, width up to XXmm)
More easily to be stamped into components than CMC
Very strong interface bonding which can repeatedly resist 850ºC heat shock
Higher thermal conductivity and lower cost

We can offer WCu, MoCu, CMC, CU/MoCu/Cu and S-CMC finished and semi-finished products. And we can also provide these products coated with Ni,NiAu or NiAg.

Product Properties:

Materials	Density at 20ºC	Coefficient of thermal expansion at 20ºC		Thermal conductivity at 25 ºC
		In - plane	thru - thickness	In - plane	thru - thickness
1:4:1	9.4	7.2	9.0	340	300

Applications:
Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages,GaAs device mount.

Powder electronics and circuits produce a lot of heat when they work, heatsink materials help to eliminate chip heat, transferring it to other media and keeping the chip stable.

Molybdenum copper, tungsten copper, CMC and CPC materials, combined with low thermal expansion rate of molybdenum, tungsten and conductivity of copper heat, can effectively release the heat of electronic device and contributes to the cooling of IGBT module, RF powder amplifier, LED chips and other products. They are thus applied as a metal substrate, thermal control and heat insulation components (heat sink materials) and the lead frame in large-scale integrated circuit and high power microwave devices.