High Thermal Conductivity Mocu Molybdenum Copper Heat Sink

• Application: Aviation, Electronics, Industrial, Medical, Chemical
• Standard: GB, ASTM
• Purity: as Required
• Alloy: Alloy
• Type: Molybdenum Plate
• Powder: Not Powder
• Model NO.: MoCu
• Size: as Required
• Surface: Ground Polished
• Delivery Time: 10-15 Days
• Advantage: Professional
• Certificate: ISO9001:2000
• Transport Package: Wooden Box
• Specification: as required
• Trademark: Tongchang
• Origin: China
• HS Code: 8102990000
• Production Capacity: 4t/Month

Product Description

    Cu/MoCu/Cu is a sandwich composite similar to Cu/Mo/Cu including a MoCu alloy core layer and two copper clad layers. The normal proportion of MoCu alloy is Mo70Cu30, sometimes Mo50Cu50 and so on .The ratio of the CTE of Cu/MoCu/Cu is tailorable. It has different CTE in x and y direction, with higher thermal conductivity than that of W Cu,MoCu & CMC. All types of Cu/Mo70Cu/Cu sheets can be stamped into components.