| Customization: | Available |
|---|---|
| Application: | Aviation, Electronics, Industrial, Medical, Chemical |
| Standard: | GB, ASTM |
|
Still deciding? Get samples of US$ 10/Piece
Request Sample
|
Suppliers with verified business licenses
Audited Supplier Audited by an independent third-party inspection agency
| Product Brief Introduction: Mo-Cu composite is similar with Tungsten-Copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu. Surface: Plating Ni, NiAu, NiAg, or Non-plating |
||||||||||||||||||||||||||||||||||||
| Product Properties: Physical Properties of Major Products
|
||||||||||||||||||||||||||||||||||||
| Applications: These composite are widely used in applications, such as, optoelectronics packages, Microwave Packages, C Packages, Laser Sub-mounts, etc. |
| Product Brief Introduction: Cu/Mo/Cu(CMC) is a sandwich composite including a molybdenum core layer and two copper clad layers. It has tailorable CTE, high thermal conductivity and high strength. All types of Cu/Mo/Cu sheets can be stamped into components. The features of copper molybdenum copper Large sized sheets available (length up to XXmm, width up to XXXmm) Can be stamped into components Strong interface bonding resist to 850ºC heat shock repeatedly Tailorable CTE matching that of semiconductor and ceramics High thermal conductivity |
||||||||||||||||||||||||||||||||
Product Properties:
|
||||||||||||||||||||||||||||||||
| Applications: Applications are similar with W-Cu composites. Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages, GaAs device mounts. |
||||||||||||||||||||||||||||||||
| Product Brief Introduction: Cu/Mo70Cu/Cu(CPC) is a sandwich composite similar to that of Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu: Mo-Cu: Cu is 1:4:1. It has different CTE in X and γ direction, with higher thermal conductivity than that of W (Mo)-Cu & Cu/Mo/Cu and less expensive. All types of Cu/Mo70Cu/Cu sheets can be stamped into components,. Features of Cu/Mo70Cu/Cu Large sized sheets available (length up to XXmm, width up to XXmm) More easily to be stamped into components than CMC Very strong interface bonding which can repeatedly resist 850ºC heat shock Higher thermal conductivity and lower cost |
||||||||||||||||||||||||||||||||
Product Properties:
|
||||||||||||||||||||||||||||||||
){kind=link}