Molybdenum tube and Crucible
Molybdenum tube purity: >99.95%
Molybdenum boat, molybdenum crucibles, sintered molybcenum tube, turning molybdenum tube, molybdenum funnels, molybdenum barrel, molybdenum tubes and various kinds of special liquid- flow hole panel, etc.
Applications:
Molybdenum is widely used to produce crucibles and other parts for Sapphire crystal growth and rare-earth melting with its high temperature resistance, low pollution and other good characteristics.
Size:
Provide all kinds of Molybdenum crucibles according to customer's drawings and machine to reach high precision.
MoCu alloy is a kind of pseudo-alloy that is composed of molybdenum and copper. It consists of both the characteristics of molybdenum and copper, having high thermal conductivity, low adjusted thermal expansion coefficient, Beijing non-magnetic, low content of gas, good vacuum resistance, good machinability and special high-temperature performance, etc.
Compared with WCu alloy, MoCu alloy has lower density and is easier to stamp, It makes MoCu suitable for valume produce.
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Product Brief Introduction:
Mo-Cu composite is similar with Tungsten-Copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.
Surface: Plating Ni, NiAu, NiAg, or Non-plating |
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Product Properties:
Physical Properties of Major Products
|
Material |
Wt%
Molybdenum Content |
Wt%
Copper Content |
g/cm3
Density at 20ºC |
Thermal conductivity at 25ºC |
Coefficient of thermal
expansion at 20ºC |
|
Mo85Cu15 |
85± 1 |
Balance |
10 |
160 - 180 |
6.8 |
|
Mo80Cu20 |
80 ± 1 |
Balance |
9.9 |
170 - 190 |
7.7 |
|
Mo70Cu30 |
70 ± 1 |
Balance |
9.8 |
180 - 200 |
9.1 |
|
Mo60Cu40 |
60 ± 1 |
Balance |
9.66 |
210 - 250 |
10.3 |
|
Mo50Cu50 |
50 ±0.2 |
Balance |
9.54 |
230 - 270 |
11.5 |
|
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Applications:
These composite are widely used in applications, such as, optoelectronics packages, Microwave Packages, C Packages, Laser Sub-mounts, etc. |
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Product Brief Introduction:
Cu/Mo/Cu(CMC) is a sandwich composite including a molybdenum core layer and two copper clad layers. It has tailorable CTE, high thermal conductivity and high strength. All types of Cu/Mo/Cu sheets can be stamped into components.
The features of copper molybdenum copper
Large sized sheets available (length up to XXmm, width up to XXXmm)
Can be stamped into components
Strong interface bonding resist to 850ºC heat shock repeatedly
Tailorable CTE matching that of semiconductor and ceramics
High thermal conductivity |
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Product Properties:
|
Materials |
Density at 20ºC |
Coefficient of thermal expansion at 20ºC |
Thermal conductivity at 25 ºC |
|
In - plane |
thru - thickness |
|
13:74:13 |
9.88 |
5.6 |
200 |
170 |
|
1:4:1 |
9.75 |
6.0 |
220 |
180 |
|
1:3:1 |
9.66 |
6.8 |
244 |
190 |
|
1:2:1 |
9.54 |
7.8 |
260 |
210 |
|
1:1:1 |
9.32 |
8.8 |
305 |
250 |
|
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Applications:
Applications are similar with W-Cu composites.
Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages, GaAs device mounts. |
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Product Brief Introduction:
Cu/Mo70Cu/Cu(CPC) is a sandwich composite similar to that of Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu: Mo-Cu: Cu is 1:4:1. It has different CTE in X and γ direction, with higher thermal conductivity than that of W (Mo)-Cu & Cu/Mo/Cu and less expensive. All types of Cu/Mo70Cu/Cu sheets can be stamped into components,.
Features of Cu/Mo70Cu/Cu
Large sized sheets available (length up to XXmm, width up to XXmm)
More easily to be stamped into components than CMC
Very strong interface bonding which can repeatedly resist 850ºC heat shock
Higher thermal conductivity and lower cost |
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Product Properties:
|
Materials |
Density at 20ºC |
Coefficient of thermal expansion at 20ºC |
Thermal conductivity at 25 ºC |
|
In - plane |
thru - thickness |
In - plane |
thru - thickness |
|
1:4:1 |
9.4 |
7.2 |
9.0 |
340 |
300 |
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| Diameter(mm) |
Wall Thickness(mm) |
Length(mm) |
| 30~50 |
0.3~10 |
<2000 |
| 50~100 |
0.5~15 |
| 100~150 |
1~15 |
| 150~300 |
1~20 |
| 300~400 |
1.5~30 |
| 400~500 |
2~30 |
| Grade |
The impurity content is not more than % |
| Fe |
Ni |
Al |
Ca |
Si |
Mg |
C |
N |
O |
| Mo-1 |
0.010 |
0.005 |
0.002 |
0.002 |
0.01 |
0.002 |
0.01 |
0.003 |
0.008 |
Mocu alloy products
Our products
High quality with reasonable price
About FAQ
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Company information
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