• Molybdenum Copper Mocu Sheet Plate
  • Molybdenum Copper Mocu Sheet Plate
  • Molybdenum Copper Mocu Sheet Plate
  • Molybdenum Copper Mocu Sheet Plate

Molybdenum Copper Mocu Sheet Plate

Application: Electronics, Industrial, Medical, Chemical, Heat Sink
Standard: ASTM
Purity: as Required
Alloy: Alloy
Type: Molybdenum Plate
Powder: Not Powder
Samples:
US$ 5/Piece 1 Piece(Min.Order)
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Customization:
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Basic Info.

Model NO.
MoCu
Grade
Mo60cu40, Mo70cu30, Mo80cu20
Surface
Ground Polished
Size
as Required
Advantage
Professional
Certificate
ISO9001:2000
Transport Package
Wooden Boxes
Specification
(0.1-20)*W*L
Trademark
Tongchang
Origin
China
HS Code
8101999000
Production Capacity
4t/Month

Product Description

MoCu alloy is a kind of pseudo-alloy that is composed of molybdenum and copper. It consists of both the characteristics of molybdenum and copper, having high thermal conductivity, low adjusted thermal expansion coefficient, Beijing non-magnetic, low content of gas, good vacuum resistance, good machinability and special high-temperature performance, etc.

Compared with WCu alloy, MoCu alloy has lower density and is easier to stamp, It makes MoCu suitable for valume produce.

Product Brief Introduction:

Mo-Cu composite is similar with Tungsten-Copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.

Surface: Plating Ni, NiAu, NiAg, or Non-plating

Product Properties:
Material Wt%
Molybdenum Content
Wt%
Copper Content
g/cm3
Density at 20ºC
Thermal conductivity at 25ºC Coefficient of thermal
expansion at 20ºC
Mo85Cu15 85± 1 Balance 10 160 - 180 6.8
Mo80Cu20 80 ± 1 Balance 9.9 170 - 190 7.7
Mo70Cu30 70 ± 1 Balance 9.8 180 - 200 9.1
Mo60Cu40 60 ± 1 Balance 9.66 210 - 250 10.3
Mo50Cu50 50 ±0.2 Balance 9.54 230 - 270 11.5


Applications:
These composite are widely used in applications, such as, optoelectronics packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.
 

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